发明名称 |
Pick-up method of die bonder and die bonder |
摘要 |
When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points. The dicing film corresponding to portions other than the above predetermined positions is then tossed to strip the die from the dicing film. |
申请公布号 |
US9343338(B2) |
申请公布日期 |
2016.05.17 |
申请号 |
US201113224366 |
申请日期 |
2011.09.02 |
申请人 |
Fasford Technology Co., Ltd. |
发明人 |
Okamoto Naoki;Yamamoto Keita |
分类号 |
H01L21/66;B32B38/10;H01L21/67 |
主分类号 |
H01L21/66 |
代理机构 |
Crowell & Moring LLP |
代理人 |
Crowell & Moring LLP |
主权项 |
1. A pick-up method of a die bonder, comprising:
determining a tossing amount of a die to be stripped out of a plurality of dies bonded to a dicing film with reference to a mapping table having tossing amount information recorded based on a measured tension of the dicing film and corresponding information on a position of the die and number of dies existing around the die on the dicing film; adsorbing the die by way of a collet and the dicing film by a dome head; and tossing the dicing film to which the die is bonded by the tossing amount determined in order to strip the die from the dicing film. |
地址 |
Minami-Alps JP |