ELECTRONIC COMPONENT MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting method capable of efficiently mounting an electronic component with high mounting position precision in a component mounting manner of supplying adhesive agent to the lower surface of an electronic component and then mounting the electronic component on a board.SOLUTION: An electronic component taken out by a mount head is recognized by a component recognition camera. The predetermined application position of the electronic component is aligned with a discharge nozzle of a dispenser unit on the basis of the recognition result, and paste is applied to the electronic component. After the paste applied on the electronic component is recognized by the component recognition camera and the application amount of the paste is checked to be within a predetermined range, the mount head 9 is made to execute a component mounting operation on the basis of the component recognition result. Accordingly, the electronic component 20 can be efficiently mounted with high mount position precision while the application amount of the paste P is properly secured.SELECTED DRAWING: Figure 14