| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device in which inclination of a circuit element soldered to a board is suppressed.SOLUTION: An electronic device 100 is configured so that a semiconductor element 10 is mounted on a circuit board 20. The semiconductor element 10 has a small type electrode 11 and a large type electrode 12, the areas of the confronting faces thereof to the circuit board 20 being different from each other. The circuit board 20 has a small type land 21 and a large type land 22 which are arranged to confront the small type electrode 11 and the large type electrode 12 respectively, the areas thereof being different according to the area of the electrode which the circuit board 20 confronts. The electronic device 100 has plural convex members 40 which are provided to extend from the circuit board 20 to a semiconductor element 10 in a large type solder 32 between the large type electrode 12 and the large type land 22. The plural convex members 40 are provided in the large type solder 32, and are formed of a material having a larger solder wettability angle than that of the large type electrode 12 and the large type land 22.SELECTED DRAWING: Figure 1 |
