发明名称 ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING DEVICE
摘要 PROBLEM TO BE SOLVED: To paste an adhesive tape accurately to the concave region on the outside of the convex region of a substrate having protrusions and recesses, where the protrusion is formed.SOLUTION: A convex region 36 where at least the protrusion, i.e., a bump 37, is formed out of the protrusions and recesses formed in a wafer W, as a substrate, is supported by an elastic first support member 34, a concave region 38 on the outer periphery of the wafer W is supported by an annular second support member 35 harder than the first support member 34, and then a support plate G is pasted, while pressing, to a double-sided adhesive tape piece T that has been pasted to the wafer W supported by the first support member 34 and second support member 35.SELECTED DRAWING: Figure 12
申请公布号 JP2016082166(A) 申请公布日期 2016.05.16
申请号 JP20140214643 申请日期 2014.10.21
申请人 NITTO DENKO CORP;NITTO SEIKI CO LTD 发明人 MATSUSHITA TAKAO
分类号 H01L21/683;H01L21/304 主分类号 H01L21/683
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