发明名称 HOUSING OF ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To increase strength and ensure a function by forming a closed cross section without depending on gas assist molding or molding using a slide core sliding widely inside a housing.SOLUTION: A method for manufacturing a housing of an electronic apparatus includes: preparing a molding mold 50 including a stationary mold 51, a movable mold 52, a first slide core 53 and a second slide core 54 sliding in a direction perpendicular to a direction clamping these molds and in a direction along a peripheral edge of a housing 3, and another piece 55 slide-moving in a direction intersecting both slide cores 53, 54 to be inserted with their tips 53a, 54a; and injecting a molten resin into a cavity with the tips 53a, 54a being supported by the another piece 55 to mold a frond-side cabinet 3 having a closed cross section continuously formed with an internal space 11 at a peripheral edge by both slide cores 53, 54.SELECTED DRAWING: Figure 1
申请公布号 JP2016074115(A) 申请公布日期 2016.05.12
申请号 JP20140204962 申请日期 2014.10.03
申请人 SHARP CORP 发明人 ITO YUTA;AOKI SHUNJI
分类号 B29C45/33;H05K5/02 主分类号 B29C45/33
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