SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor device and a manufacturing method thereof, which can reduce a size of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for a reduction in package size based at least in part on patterning techniques for forming interconnection structures.

主权项

1. A method of manufacturing a semiconductor package, the method comprising:
forming a dielectric layer on a semiconductor die, where the semiconductor die comprises a die pad; forming a conductive layer on the dielectric layer, wherein the conductive layer is electrically connected to the die pad through an opening in the dielectric layer; forming a first temporary structure on the conductive layer; forming a mold material to cover at least portions of the dielectric layer, the conductive layer and the first temporary structure; removing the first temporary structure from the mold material; and forming an interconnection structure in a cavity in the mold material created by said removing the first temporary structure.