| 发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
| 摘要 |
A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region. |
| 申请公布号 |
US2016133810(A1) |
申请公布日期 |
2016.05.12 |
| 申请号 |
US201514982013 |
申请日期 |
2015.12.29 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
JUNG Su Jung;KIM Byung Mok;CHO Young Jun;KWON Seo Yeon |
| 分类号 |
H01L33/64;H01L33/32;H01L33/56;H01L25/16;H01L33/40;H01L33/50;H01L33/06;H01L33/62 |
主分类号 |
H01L33/64 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device package comprising:
a package body has a cavity; a lead frame disposed in the cavity; a heat radiating member disposed tinder the cavity; a light emitting device disposed on the heat radiation member; a bonding member disposed between the light emitting device and the heat radiating member; and a bonding member fixing part disposed in the cavity and covering a side surface of the bonding member, wherein the bonding member fixing part forms the bottom of the cavity, wherein the heat radiating member has an extension part and the extension part vertically overlaps with the lead frame. |
| 地址 |
Seoul KR |
