发明名称 |
SEMICONDUCTOR BONDING WITH COMPLIANT RESIN AND UTILIZING HYDROGEN IMPLANTATION FOR TRANSFER-WAFER REMOVAL |
摘要 |
A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light. |
申请公布号 |
US2016133496(A1) |
申请公布日期 |
2016.05.12 |
申请号 |
US201514933694 |
申请日期 |
2015.11.05 |
申请人 |
SKORPIOS TECHNOLOGIES, INC. |
发明人 |
Lambert Damien;Spann John;Krasulick Stephen |
分类号 |
H01L21/683;H01L21/027;H01L23/00 |
主分类号 |
H01L21/683 |
代理机构 |
|
代理人 |
|
主权项 |
1. (canceled) |
地址 |
Albuquerque MN US |