| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique enabling fillability of an encapsulation member to be improved.SOLUTION: A power semiconductor device comprises an insulation substrate 1, a semiconductor element 2, a case 4, and a wiring member 5. The case 4 forms a container body having a bottom face that is a surface bonded with the semiconductor element 2, of the insulation substrate 1. The wiring member 5 has a junction part located above an upper surface electrode 2a of the semiconductor element 2. At the junction part of the wiring member 5, a projection 5b protruding to the upper surface electrode 2a side of the semiconductor element 2 and bonded with the upper surface electrode 2a by solder 6, and a through-hole 5c penetrating through the junction part in a thickness direction via the projection 5b, are provided.SELECTED DRAWING: Figure 3 |
