发明名称 |
Packaged Semiconductor Die with Bumpless Die-Package Interface for Bumpless Build-Up Layer (BBUL) Packages |
摘要 |
A packaged semiconductor die with a bumpless die-package interface and methods of fabrication are described. For example, a semiconductor package includes a substrate having a land side with a lowermost layer of conductive vias. A semiconductor die is embedded in the substrate and has an uppermost layer of conductive lines, one of which is coupled directly to a conductive via of the lowermost layer of conductive vias of the substrate. In another example, a semiconductor package includes a substrate having a land side with a lowermost layer of conductive vias. A semiconductor die is embedded in the substrate and has an uppermost layer of conductive lines with a layer of conductive vias disposed thereon. At least one of the conductive lines is coupled directly to a conductive via of the semiconductor die which is coupled directly to a conductive via of the lowermost layer of conductive vias of the substrate. |
申请公布号 |
US2016133590(A1) |
申请公布日期 |
2016.05.12 |
申请号 |
US201514998093 |
申请日期 |
2015.12.23 |
申请人 |
MALATKAR Pramod;TEH Weng Hong;GUZEK John S.;SANKMAN Robert L. |
发明人 |
MALATKAR Pramod;TEH Weng Hong;GUZEK John S.;SANKMAN Robert L. |
分类号 |
H01L23/00;H01L23/538 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. (canceled) |
地址 |
Chandler AZ US |