| 摘要 |
A deviation in mounting a temperature sensor unit is eliminated. In a second cavity 47 for mounting a temperature sensor unit 3 of a base 4, exposed electrodes 6 that intersect at least an internal wall surface 474 of a second wall portion 45 are formed so as to be exposed within the second cavity 47. The exposed electrodes 6 include a pair of temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded via a solder 13. The solder 13 is formed so as to cover an entire surface of the exposed electrodes 6 including the temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded. |
