发明名称 1-D tire patch apparatus and methodology
摘要 Disclosed is a tire mountable apparatus and method that includes a substrate defining a longitudinal direction, a top surface and a bottom surface. The substrate has a plurality of conductor terminals arranged in a substantially linear relationship. A first support element is located below the bottom surface of the substrate and a second support element is located above the top surface of the substrate. The plurality of conductor terminals are positioned between the first and second support elements. The substrate may be a piezoelectric device having a piezoelectric layer arranged between first and second conductive layers. The plurality of conductor terminals may be arranged in a substantially linear relationship along a line about 80° to about 100° to the longitudinal direction of the substrate, and the longitudinal direction of the substrate being substantially perpendicular to the direction of rotation of the tire.
申请公布号 US9333811(B2) 申请公布日期 2016.05.10
申请号 US201414250569 申请日期 2014.04.11
申请人 Compagnie Generale Des Etablissements Michelin;Michelin recherche et Technique S.A. 发明人 Weston David Alan;Hodgkinson Raymond Leslie
分类号 B21D39/03;B60C19/00;H01L41/113;B60C23/04;G01M17/02;H01L41/25;B29D30/00 主分类号 B21D39/03
代理机构 Dority & Manning, P.A. 代理人 Dority & Manning, P.A.
主权项 1. A method for reducing strain in a tire mounted assembly, comprising: providing a substrate defining a longitudinal direction, a top surface and a bottom surface, the substrate comprising a plurality of conductor terminals arranged in a substantially linear relationship; positioning a first support element beneath the bottom surface of the substrate so that the first support element overlaps the plurality of conductor terminals of the substrate; and positioning a second support element above the top surface of the substrate so that the second support element overlaps the plurality conductor terminals of the substrate; providing a pair of first and second posts extending from the first support element; connecting each of the first and second posts to one of the plurality of conductor terminals arranged on the substrate; and securing a printed circuit board to the pair of first and second posts such that the printed circuit board is supported above the second support element.
地址 FR