发明名称 |
1-D tire patch apparatus and methodology |
摘要 |
Disclosed is a tire mountable apparatus and method that includes a substrate defining a longitudinal direction, a top surface and a bottom surface. The substrate has a plurality of conductor terminals arranged in a substantially linear relationship. A first support element is located below the bottom surface of the substrate and a second support element is located above the top surface of the substrate. The plurality of conductor terminals are positioned between the first and second support elements. The substrate may be a piezoelectric device having a piezoelectric layer arranged between first and second conductive layers. The plurality of conductor terminals may be arranged in a substantially linear relationship along a line about 80° to about 100° to the longitudinal direction of the substrate, and the longitudinal direction of the substrate being substantially perpendicular to the direction of rotation of the tire. |
申请公布号 |
US9333811(B2) |
申请公布日期 |
2016.05.10 |
申请号 |
US201414250569 |
申请日期 |
2014.04.11 |
申请人 |
Compagnie Generale Des Etablissements Michelin;Michelin recherche et Technique S.A. |
发明人 |
Weston David Alan;Hodgkinson Raymond Leslie |
分类号 |
B21D39/03;B60C19/00;H01L41/113;B60C23/04;G01M17/02;H01L41/25;B29D30/00 |
主分类号 |
B21D39/03 |
代理机构 |
Dority & Manning, P.A. |
代理人 |
Dority & Manning, P.A. |
主权项 |
1. A method for reducing strain in a tire mounted assembly, comprising:
providing a substrate defining a longitudinal direction, a top surface and a bottom surface, the substrate comprising a plurality of conductor terminals arranged in a substantially linear relationship; positioning a first support element beneath the bottom surface of the substrate so that the first support element overlaps the plurality of conductor terminals of the substrate; and positioning a second support element above the top surface of the substrate so that the second support element overlaps the plurality conductor terminals of the substrate; providing a pair of first and second posts extending from the first support element; connecting each of the first and second posts to one of the plurality of conductor terminals arranged on the substrate; and securing a printed circuit board to the pair of first and second posts such that the printed circuit board is supported above the second support element. |
地址 |
FR |