发明名称 |
Ball grid array rework |
摘要 |
Embodiments of the invention relates to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components. |
申请公布号 |
US9338885(B2) |
申请公布日期 |
2016.05.10 |
申请号 |
US201414324647 |
申请日期 |
2014.07.07 |
申请人 |
International Business Machines Corporation |
发明人 |
Kline Eric V.;Sinha Arvind K. |
分类号 |
H01L23/48;H01L23/52;H01L29/40;H05K1/11;H05K13/04;B23K1/018 |
主分类号 |
H01L23/48 |
代理机构 |
Lieberman & Brandsdorfer, LLC |
代理人 |
Lieberman & Brandsdorfer, LLC |
主权项 |
1. An apparatus comprising:
a ball grid array (BGA) package assembled on to a printed circuit board; an expansion material placed between the BGA package and the printed circuit board, including interstitial placement of the material within a matrix of solder joints between the BGA package and the printed circuit board; an applicator in communication with the material, the applicator to apply a tensile force between a ball grid array (BGA) package and the printed circuit board, including delivery of electric current to the expansion material, wherein the application of the tensile force is controlled by a regulator in communication with the applicator; a localized heating of the expansion material created from the current; an expansion force applied to the solder joints from the heated material, the expansion force including separation of the BGA from the printed circuit board. |
地址 |
Armonk NY US |