Package structure and methods of forming same

摘要

A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer.

主权项

1. A method of forming a semiconductor device, the method comprising:
bonding a first optical device to a first side of a first substrate; forming a vertical waveguide on a top surface of the first optical device; bonding a second side of a second substrate to the first side of the first substrate, the second side of the second substrate being over the vertical waveguide; and forming a lens capping layer on a first side of the second substrate, the first side being opposite the second side, a portion of the second substrate being directly between the vertical waveguide and the lens capping layer.