| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of improving productivity of a semiconductor laser device by improving work efficiency in the semiconductor laser device or fields of application thereof.SOLUTION: The semiconductor laser device includes: a base 10; a semiconductor laser element which is fixed at a top face side of the base; a cap 30 including a window part 31 provided at the top face side of the base so as to cover the semiconductor laser element; a first block part which is provided outside of the cap at the top face side of the base or at a bottom face side of the base and of which the surface electrically connected to a first electrode of the semiconductor laser element via first wiring is formed from a metal; and a second block part which is provided outside of the cap at the top face side of the base or at the bottom face side of the base and of which the surface electrically connected to a second electrode of the semiconductor laser element via second wiring is formed from a metal. Each of the first block part and the second block part includes at least one or more mounting surfaces so as to be mounted on a mounting substrate in two or more different directions.SELECTED DRAWING: Figure 1A |
