| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which properly jets a fluid to a space between a substrate and an elastic film and prevents contamination of the substrate when the substrate is removed even if the space formed between the substrate and the elastic film is small.SOLUTION: A polishing device includes: a polishing table 10 for supporting a polishing pad 20; a polishing head 1 which has a substrate holding surface 4b formed by an elastic film 4 and a pressure chamber 5, holds a substrate W with the substrate holding surface 4b, and presses the substrate W to the polishing pad 20 by a pressure in the pressure chamber 5; and a release nozzle 53 which jets release jet flow to a space between the substrate W and the elastic film 4 to separate the substrate W from the substrate holding surface 4b. The release nozzle 53 is formed as a laval nozzle capable of jetting supersonic speed parallel flow.SELECTED DRAWING: Figure 4 |
