SOLID DENDRITIC FILLER, RESIN COMPOSITION, MOLDED BODY, AND METHOD FOR PRODUCING SOLID DENDRITIC FILLER

摘要

PROBLEM TO BE SOLVED: To provide an Si/SiC filler 1 lightened in weight without deteriorating its mechanical strength and thermal conductivity, a resin composition, a molded body, and a method for producing the Si/SiC filler 1.SOLUTION: Provided is an Si/SiC filler 1 formed with an Si/SiC porous structure formed on a silicon film 4 by impregnating molten silicon to a SiC porous structure including silicon carbide and in which the inside of an outer shell 2 is hollow into a solid dendritic shape by breaking.SELECTED DRAWING: Figure 1