| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing composition that a polishing rate is high and can achieve a profile irregularity of a polishing target surface enough to an actual use by using silica abrasive grains.SOLUTION: A polishing composition contains abrasive grains, acid and water. The abrasive grains contain silica abrasive grains A which are other than colloidal silica, have a specific surface area of 2 m/g or more and 60 m/g or less, and an average particle diameter of 50 nm or more and 15000 nm or less.SELECTED DRAWING: None |
