EFFICIENT TEMPERATURE FORCING OF SEMICONDUCTOR DEVICES UNDER TEST

摘要

A temperature-forcing system and method for controlling the temperature of an electronic device under test comprises a temperature-forcing head, including a face positionable in thermal contact with the device, and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser, a flow control device for inducing a pressure drop in the refrigerant, and a conduit circuit through which the refrigerant is flowable. The subsystem cooperates with the evaporator so as to define at least one closed loop through which a corresponding bi-phase refrigerant is circulatable, so that, during circulation, the refrigerant is maintained in a liquid phase between the compressor and the flow control device and in a gaseous phase while flowing through the evaporator. The temperature of the device is therefore switchable by the head at a rapid rate of 50 to 150 degrees Celsius per minute.

主权项

1. A temperature-forcing system, for controlling the temperature of an electronic device under test, comprising:
a) a temperature-forcing head, including a face positionable in thermal contact with said device, and an evaporator, in direct or indirect thermal contact with said face; and b) a refrigerant circulation subsystem, including a compressor, a condenser, a flow control device for inducing a pressure drop in said refrigerant, and a conduit circuit through which said refrigerant is flowable,
wherein said subsystem is configured to cooperate with said evaporator so as to define at least one closed loop through which a corresponding bi-phase refrigerant is circulatable, so that, during circulation, said refrigerant is maintained in a liquid phase between the compressor and the flow control device and in a gaseous phase while flowing through the evaporator,wherein the temperature of said device is switchable by means of said head at a rate of 50 to 150 degrees Celsius per minute.