POLISHING APPARATUS AND POLISHING METHOD

摘要

A polishing apparatus capable of polishing a substrate while accurately measuring a temperature at a desired measuring point near a surface of the substrate is disclosed. The polishing apparatus includes: a polishing pad having a polishing surface for polishing a substrate; a polishing table supporting the polishing pad; a table motor configured to rotate the polishing table; a polishing head configured to press a surface of the substrate against the polishing surface of the polishing pad; a polishing liquid supply nozzle configured to supply a polishing liquid onto the polishing surface of the polishing pad; and a temperature sensor mounted to the polishing table. The temperature sensor is located so as to move across the surface of the substrate each time the polishing table makes one revolution.

主权项

1. A polishing apparatus comprising:
a polishing pad having a polishing surface for polishing a substrate; a polishing table supporting the polishing pad; a table motor configured to rotate the polishing table; a polishing head configured to press a surface of the substrate against the polishing surface of the polishing pad; a polishing liquid supply nozzle configured to supply a polishing liquid onto the polishing surface of the polishing pad; and a temperature sensor mounted to the polishing table, the temperature sensor being located so as to move across the surface of the substrate each time the polishing table makes one revolution.