| 摘要 |
A die supply device that supplies dies and multiple feeders that supply a passive component to be combined with the die are both loaded on a component mounter. Wafer map data to which a ranking of a characteristic of each die on a wafer is added, and passive component combination data that specifies a combination passive component with the optimum characteristic for each rank of die from multiple passive components with a different characteristic, are created. The multiple feeders supply the multiple passive components with a different characteristic to the component mounter; the die supply device supplies each die of the wafer to the component mounter in the order in which the dies are arranged on the wafer; the component mounter mounts the passive component to be combined with the die supplied from the die supply device on the circuit board by selecting the passive component from the multiple passive components with a different characteristic based on the wafer map data and the passive component combination data. Thus, variance in a characteristic of the dies is absorbed. |
