| 摘要 |
A method for manufacturing an electronic device is provided, including the following steps. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member. Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member. Then, a punch pin and a punch base are provided. Next, the connected structure is placed on the punch base. Finally, the connected structure is punched by the punch pin. |
| 主权项 |
1. A method for manufacturing an electronic device, comprising:
providing an outer frame, wherein the outer frame comprises a first frame member and a second frame member; connecting the first frame member to the second frame member by welding to form a connected structure; providing a punch pin and a punch base; placing the connected structure on the punch base; and punching the connected structure with the punch pin; wherein the punch base comprises a base surface, and the first frame member and the second frame member are placed on the base surface to be punched; and wherein the punch pin comprises a shaping plane and a shaping protrusion, the shaping protrusion is formed on the shaping plane, and the shaping protrusion corresponds to a welded portion where the first frame member and the second frame member are connected to each other. |
