发明名称 |
Electrical connector |
摘要 |
An electrical connector allowing a housing and a contact portion to be displaced relative to a mounting circuit board, parallel to a board surface, without a reinforcing plate separate from a contact member. A basal portion of a contact member is present along an upper surface of a base portion of a housing. A mounting-side elastic portion of the contact member is present along a lower surface of the base portion of the housing. A folding-back portion of the contact member is located at a rear of the base portion of the housing to connect the basal portion to the mounting-side elastic portion. First and second connecting leg portions extend downward from the mounting-side elastic portion. Each tip side of the leg portions acts as a mounting portion for a circuit board at positions different from each other in a front-back direction. |
申请公布号 |
US9331415(B2) |
申请公布日期 |
2016.05.03 |
申请号 |
US201314378702 |
申请日期 |
2013.02.25 |
申请人 |
YOKOWO CO., LTD. |
发明人 |
Tagawa Yoshio |
分类号 |
H01R24/00;H01R13/24;H01R12/55;H01R12/71 |
主分类号 |
H01R24/00 |
代理机构 |
Leydig, Voit & Mayer, Ltd. |
代理人 |
Leydig, Voit & Mayer, Ltd. |
主权项 |
1. An electrical connector comprising:
an insulating housing; and a conductive contact member, wherein,
when a direction toward a mounting object board is downward, the conductive contact member has
a basal portion fixed to the insulating housing,a contact-side elastic portion rising from the basal portion and having a contact portion,first and second connecting leg portions having respective tip sides, each of the tip sides acting as a mounting portion for the board at positions different from each other, anda mounting-side elastic portion disposed between the basal portion and the first and second connecting leg portions, andthe insulating housing has a convex portion located on a lower surface of the insulating housing, wherein
a cover portion facing the lower surface of the insulating housing extends from the convex portion, anda portion of the first connecting leg portion is located in a gap between the lower surface of the insulating housing and the cover portion. |
地址 |
Tokyo JP |