Method for making electrically conductive three-dimensional structures

摘要

Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.

主权项

1. A method for fabricating a three-dimensional, electrically conductive structure comprising:
providing a mold having at least one microdepression which defines a three-dimensional structure; depositing and patterning at least one electrically conductive layer within the microdepression of the mold; filling the microdepression of the mold with at least one substantially electrically non-conductive substrate material; molding the at least one substrate material to form a substrate on top of the at least one electrically conductive layer while the at least one non-conductive substrate material abuts an outer surface of the at least one electrically conductive layer opposite the mold; and transferring the at least one electrically conductive layer to the substrate, thereby forming an electrically conductive structure.