Heat spreading structures for integrated circuits

摘要

A heat spreader structure includes a planar portion and a slanted portion. The slanted portion extends at an angle from an edge of the planar portion. The first slanted portion includes a first slot. A second heat spreader structure includes a planar member, a first edge member and a second edge member. The first edge member extends only perpendicularly from a first edge of the planar member whereas the second edge member extends from the second edge of the planar member and has a slanted surface with respect to that of the planar member. In addition to that, the first and second heat spreader structure may be formed using different manufacturing methods.

主权项

1. An integrated circuit heat spreading structure, comprising:
a planar portion; and a slanted portion that extends at an angle from an edge of the planar portion, wherein a slot is formed in the slanted portion, wherein the integrated circuit heat spreading structure forms a part of an integrated circuit package that includes a package substrate, an integrated circuit mounted on the package substrate, and a passive device mounted on the package substrate adjacent to the integrated circuit, wherein the integrated circuit is interposed between the package substrate and the integrated circuit heat spreading structure, and wherein a top portion of the passive device penetrates through the slot in the integrated circuit heat spreading structure.