发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide: a photosensitive resin composition that can form a pattern with excellent resolution and is excellent in PCT resistance (moist-heat resistance), reflow resistance, electrical insulation (HAST resistance), electroless plating resistance, solder heat resistance and the like required for refinement of a pitch, in addition to heat resistance, adhesion, mechanical characteristics and electrical characteristics; a photosensitive element and a permanent mask resist using the same; and a printed wiring board comprising the permanent mask resist.SOLUTION: A photosensitive resin composition comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a photoinitiator, (C) an inorganic filler, (D) a photopolymerizable compound, and (E) an alkoxypolysiloxane, where the (E) alkoxypolysiloxane has a specific structure. Also provided are a photosensitive element, a permanent mask resist and a printed wiring board using the photosensitive resin composition.SELECTED DRAWING: None
申请公布号 JP2016066004(A) 申请公布日期 2016.04.28
申请号 JP20140195550 申请日期 2014.09.25
申请人 HITACHI CHEMICAL CO LTD 发明人 KOJIMA MASAYUKI;YOSHINO TOSHISUMI;FUSE YOSHIAKI;SATO KUNIAKI
分类号 G03F7/075;C08G59/17;G03F7/004;G03F7/027;H05K3/28 主分类号 G03F7/075
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