SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING THE SAME, AND COPPER-CLAD LAMINATE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a copper-clad laminate enabling FPC with bondability (bondability of copper foil and resin film) at the same degree as or a higher degree than ever before even when a bonding face of the copper foil and the resin film has less roughness than before, surface-treated copper foil for obtaining the copper-clad laminate, and a method for producing the surface-treated copper foil.SOLUTION: In surface treated copper foil of this invention, a plurality of coating layers are formed on a surface on the side of original copper foil bonded to the resin film. The plurality of coating layers comprises: a base nickel plating layer formed on the original copper foil; a roughened copper plating layer formed on the base nickel plating layer and comprising roughened copper crystal particles that have a predetermined average particle size; and a zinc plating layer formed on the roughened copper plating layer.SELECTED DRAWING: Figure 1