| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dispersion for chemical and mechanical polishing which satisfies all characteristics of the stability by which silica particles are not precipitated, the high polishing rate for an aluminum film and the low polishing rate of a silicon oxide film, and to provide a chemical and mechanical polishing method using the same. <P>SOLUTION: The dispersion contains (A) the silica particle having at least one kind of a functional group selected from a group comprising sulfo group and its salt and (B) a water-soluble polymer including a repeating unit originating in at least one kind selected from a group comprising N-vinyl pyrrolidone and its derivative and has pH of ≥2 and ≤8. <P>COPYRIGHT: (C)2013,JPO&INPIT |
