发明名称 |
Cooling structure |
摘要 |
A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity λ of the heat conduction layer is 1.0 W/(m·K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity ε of the heat radiation layer is 0.7 or more. |
申请公布号 |
US9322541(B2) |
申请公布日期 |
2016.04.26 |
申请号 |
US201414569045 |
申请日期 |
2014.12.12 |
申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
Hino Hirohisa;Kishi Arata;Nawa Honami |
分类号 |
H01M10/50;F21V29/15;H01M10/653;H01M10/6551;H01M10/655;H01M10/613;H01M10/66;H01M4/86 |
主分类号 |
H01M10/50 |
代理机构 |
Panasonic Patent Center |
代理人 |
Panasonic Patent Center |
主权项 |
1. A cooling structure, comprising:
a heat conduction layer including a first paste coated on a surface of a heat-producing object; and a heat radiation layer including a second paste coated on a surface of the heat conduction layer, wherein the heat conduction layer comprises a first resin and a first filler, and a heat conductivity λ of the heat conduction layer is 1.0 W/(m·K) or more, and the heat radiation layer comprises a second resin and a second filler, and an infrared emissivity ε of the heat radiation layer is 0.7 or more. |
地址 |
Osaka JP |