Semiconductor device

摘要

On a single semiconductor package PK1, m semiconductor chips CP1 to CPm are mounted, and the semiconductor package PK1 has external terminals T shared by m pad electrodes PD1 to PDm of the m semiconductor chips CP1 to CPm. An electrostatic protection circuit CD is mounted on only one CPm of the m semiconductor chips CP1 to CPm.

主权项

1. A semiconductor device comprising a semiconductor package:
the semiconductor package comprising, a first chip comprising a first pad and a first circuit connected to the first pad via a first resistor, a second chip comprising a second pad and a second circuit connected to the second pad via a second resistor and an electrostatic protection circuit the electrostatic protection circuit being connected at a junction between the second resistor and the second circuit, and an external terminal electrically connected to the first pad and the second pad, wherein the electrostatic protection circuit comprises a first diode and a second diode formed on the second chip, and the junction is connected to a first voltage potential via the first diode and connected to a second voltage potential via the second diode.