| 摘要 |
A microelectronic package of the present description includes a microelectronic interposer having a first surface. An active surface of at least one microelectronic device can be electrically attached onto the first surface of the microelectronic interposer. A thermal interface material can be arranged on the back surface of the at least one microelectronic device. A heat spreader having a second surface facing the first surface can be in thermal contact with the thermal interface material by the first surface. A mold member is arranged to encapsulate the microelectronic device, the thermal interface material, and the heat spreader. The mold member touches at least part of the first surface of the microelectronic interposer. So, the cost of the heat spreader can be reduced. |
