| 摘要 |
PROBLEM TO BE SOLVED: To provide a coated substrate improved in adhesion and insulation properties of an insulating film by forming the insulating film which is coated on a substrate and with which electrical insulation properties, heat resistance and solvent resistance can be obtained, and forming an adhesion enhancement film between the substrate and the insulation film, the adhesion enhancement film being an underlayer of the insulation film.SOLUTION: In a coated substrate, an adhesion enhancement film is formed on a substrate, and an insulating film is formed on the adhesion enhancement film, the adhesion enhancement film being a film containing poly siloxane having an organic group with a multiple coupling structure, and the insulating film being a film containing polyether or polyisocyanurate having an organic group with a multiple coupling structure. The adhesion enhancement film is formed of an adhesion enhancement film formation composition containing poly siloxane having a vinyl group, a carbonyl group or an organic group containing the vinyl group or the carbonyl group. The coated substrate coats a polished surface of a wafer reduced in thickness. The coated substrate protects a circuit surface on which a circuit of a wafer reduced in thickness is formed.SELECTED DRAWING: None |
