发明名称 HOT MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a hot melt adhesive composition that expresses a sufficient adhesive force against a low-polarity adherend such as an adherend comprising a polyolefin such as polyethylene and polypropylene to which conventional hot melt adhesive compositions have difficulty to adhere, expresses a moderate adhesive force against other adherends such as glass, stainless steel, acrylic resin, and can be smoothly peeled off without staining an adherend at peeling off, and to provide an adhesive tape and an adhesive film using the hot melt adhesive composition.SOLUTION: A hot melt adhesive composition includes: an aromatic vinyl-conjugated diene block copolymer (I) having a number average molecular weight of 20,000-500,000 and including at least one polymer block (P) comprising an aromatic vinyl compound unit and at least one polymer block (Q) comprising a conjugated diene compound unit of which at least a part of carbon-carbon unsaturated double bonds may be hydrogenated; and an acrylic block copolymer (II) including at least one polymer block (A) comprising a methacrylate unit and at least one polymer block (B) comprising an acrylate unit. The mass ratio of the aromatic vinyl-conjugated diene block copolymer (I) to the acrylic block copolymer (II) is 99:1 to 41:59.SELECTED DRAWING: None
申请公布号 JP2016056296(A) 申请公布日期 2016.04.21
申请号 JP20140184234 申请日期 2014.09.10
申请人 KURARAY CO LTD 发明人 MORISHITA YOSHIHIRO;KANEMURA HIDEAKI;NAKADA KANAYO
分类号 C09J153/02;B32B27/00;B32B27/30;C08F297/02;C08F297/04;C09J7/02;C09J11/08;C09J133/04 主分类号 C09J153/02
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