| 摘要 |
The present invention relates to an NCF for manufacturing a semiconductor package, a method for manufacturing the same and a method for manufacturing the semiconductor package using the same, and more particularly, to an NCF which is used as a bonding medium when attaching a semiconductor chip having a conductive bump to a substrate, a method for manufacturing the same and a method for manufacturing a semiconductor package using the same. To this end, the present invention provides an NCF having a novel structure and a method for manufacturing the NCF, wherein the NCF is formed at four edges thereof with recess parts to perfectly prevent the NCF from riding over the top surface of a semiconductor chip when the semiconductor chip is pressed through a thermal compression scheme. The present invention also provides a method for manufacturing a semiconductor package using an NCF, which ensures a horizontal state of a semiconductor chip by preventing generation of fillets when attaching the semiconductor chip to a substrate by using the NCF having recess parts and allows stack semiconductor chips to be readily stacked on the semiconductor chip maintained in the horizontal state. |
