发明名称 |
Cooling assembly using heatspreader |
摘要 |
Various embodiments relate to a microchip die cooling assembly comprising a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; and a second thermal interface material in contact with the top side of the heat spreader and the bottom side of the heat sink. |
申请公布号 |
US9318410(B2) |
申请公布日期 |
2016.04.19 |
申请号 |
US201314037706 |
申请日期 |
2013.09.26 |
申请人 |
Alcatel Lucent |
发明人 |
De Cecco Stefano F.;Cheshire Gregory W. |
分类号 |
H01L23/36;H01L21/48;H01L23/42;H01L23/40 |
主分类号 |
H01L23/36 |
代理机构 |
Kramer & Amado, P.C. |
代理人 |
Kramer & Amado, P.C. |
主权项 |
1. A microchip die cooling assembly comprising:
a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side, the bottom side being positioned above the microchip; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; a second thermal interface material in contact with the top side of the heatspreader and the bottomside of the heat sink; a pin connected to the heatspreader and circuit board securing the heatspreader to the circuit board; and a spring connected to the pin to bias the heatspreader against the microchip. |
地址 |
Boulogne-Billancourt FR |