| 发明名称 | Method and apparatus for liquid treatment of wafer shaped articles | ||
| 摘要 | In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. The apparatus includes a heating assembly having a housing that contains at least one infrared heating element. The heating assembly is mounted above an upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing comprises a gas inlet connected to a gas supply, and at least one outlet for discharging gas from the housing. | ||
| 申请公布号 | US9316443(B2) | 申请公布日期 | 2016.04.19 |
| 申请号 | US201213593264 | 申请日期 | 2012.08.23 |
| 申请人 | LAM RESEARCH AG | 发明人 | Hohenwarter Karl-Heinz;Badam Vijay;Semmelrock Christoph |
| 分类号 | F27D5/00;H01L21/67 | 主分类号 | F27D5/00 |
| 代理机构 | Young & Thompson | 代理人 | Young & Thompson |
| 主权项 | 1. Apparatus for treating a wafer-shaped article, comprising: a spin chuck for holding a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck; and a heating assembly comprising a housing containing at least one infrared heating element, said heating assembly being mounted above said upper surface of said spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck, wherein said housing comprises a gas inlet connected to a gas supply, and at least one outlet for discharging gas from said housing; wherein said heating assembly is mounted underlying a wafer-shaped article when mounted on the spin chuck, the heating assembly being stationary in relation to rotation of said spin chuck. | ||
| 地址 | Villach AT | ||