| 发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT |
| 摘要 |
PROBLEM TO BE SOLVED: To improve the wiring flexibility of a metal on the undermost layer in a semiconductor integrated circuit.SOLUTION: A power supply line is formed by a diffusion layer.SELECTED DRAWING: Figure 5 |
| 申请公布号 |
JP2016054172(A) |
申请公布日期 |
2016.04.14 |
| 申请号 |
JP20140178540 |
申请日期 |
2014.09.02 |
| 申请人 |
RICOH CO LTD |
发明人 |
MATSUMOTO KENICHI |
| 分类号 |
H01L21/82;H01L21/822;H01L27/04 |
主分类号 |
H01L21/82 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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