SILVER PASTE, SEMICONDUCTOR DEVICE USING THE SAME AND METHOD FOR PRODUCING SILVER PASTE

摘要

PROBLEM TO BE SOLVED: To provide a silver paste that can form a silver sintered body having high denseness even when sintered at a low temperature and at a low pressure (or under non-pressure), exhibits sufficient bond strength even when bonded to a metal other than silver and can be sintered and bonded even in an oxygen-free atmosphere, to provide a semiconductor device using the silver paste and to provide a method for producing the silver paste.SOLUTION: The silver paste contains a silver particle and a solvent. The silver particle includes (A) a spherical silver particle having a particle size of 1 to 300 nm which is coated with a specific protective agent, (B) a monocrystal silver particle having a particle size of 10 nm to 7 μm which is coated with a specific protective agent and (C) a nonspherical silver particle having a particle size of 500 nm to 20 μm which is coated with a specific protective agent.SELECTED DRAWING: Figure 9