发明名称 CIRCUIT BOARD TESTING APPARATUS AND CIRCUIT BOARD TESTING METHOD
摘要 In a circuit board testing apparatus for performing a four-terminal measurement method on a wiring pattern formed of a plurality of wires on a circuit board, a control part connects in series contact probes to be connected to upstream-side voltage detection terminals or downstream-side voltage detection terminals, via connection terminals, allows a power supply part to apply power between the test points with which the contact probes connected in series are in contact, allows a voltage detection part to detect a voltage between the test points, and makes a determination as to conductive contact states of the contact probes with the test points, based on the detected voltage.
申请公布号 US2016103172(A1) 申请公布日期 2016.04.14
申请号 US201514876846 申请日期 2015.10.07
申请人 NIDEC-READ CORPORATION 发明人 Yamashita Munehiro
分类号 G01R31/28;G01R1/073 主分类号 G01R31/28
代理机构 代理人
主权项 1. A circuit board testing apparatus for measuring at least one electrical characteristic of a wiring pattern formed of a plurality of wires on a circuit board, the wiring pattern having at least two test points defined thereon, the apparatus comprising: at least two pairs of contact probes each of the pairs of contact probes configured to establish electrical contact with one of said test points, each contact probe comprising, respectively: an upstream power terminal having a switchable connection to an upstream side of a power supply part,a downstream power terminal having a switchable connection to a downstream side of the power supply part,an upstream voltage detection terminal having a switchable connection to an upstream side of a voltage detection part,a downstream voltage detection terminal having a switchable connection to a downstream side of the voltage detection part, anda switchable connection terminal; and a control part configured to perform a measurement of a first value related to the at least one electrical characteristic of the wiring pattern, based on a determination of a second value related to a contact state of the at least two pairs of contact probes to the two respective test points.
地址 Kyoto JP