发明名称 Lightweight cavity filter and radio subsystem structures
摘要 Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and radio subsystems such as antennas and filters. The novel structures are fabricated by electroplating the required structure over a mold, housing, or substrate. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.
申请公布号 US9312594(B2) 申请公布日期 2016.04.12
申请号 US201213626700 申请日期 2012.09.25
申请人 Intel Corporation 发明人 Burke Ian;Cook Jason;Khanifar Ahmad
分类号 H01P1/208;H01P7/06;H01P11/00;C23C18/16;C23C28/02 主分类号 H01P1/208
代理机构 Schwegman Lundberg & Woessner, P.A. 代理人 Schwegman Lundberg & Woessner, P.A.
主权项 1. A cavity filter, comprising: an insulated foam housing having a contoured surface of an inverse of a cavity filter structure to provide one or more foam-filled cavities; an electro-less plated layer of first metal deposited onto the contoured surface of the insulated foam housing; and an electro-plated layer of second metal deposited on top of the layer of first metal, wherein a total thickness of the layers of first and second metal is between one and three skin depths associated with an operating radio frequency of the cavity filter structure and is less than or equal to 5 micrometers, and wherein the layer of first metal comprises electro-less plated silver and the layer of second metal comprises electro-plated copper.
地址 Santa Clara CA US