| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate and manufacturing method of the circuit substrate that can suppress occurrence of a disconnection of lead wiring.SOLUTION: A circuit substrate 1 comprises: a substrate 2; at least one electrode unit 4 that is provide in a main face of the substrate 2, and has mesh-like wiring patterns 411 and 421 composed of a plurality of thin wires; and at least one lead wiring 51 that is formed in the main face of the substrate 2 and is connected to the second wiring pattern 421. The electrode unit 4 has: a first region 41; and a second region 42 that has relatively low wiring density Pwith respect to wiring density Pin the first region 41, and the lead wiring 51 is connected to the electrode unit 4 in the second region 42.SELECTED DRAWING: Figure 1 |
