| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of favorably connecting electrode terminals and semiconductor element connection pads of a semiconductor element via solder bumps.SOLUTION: A wiring board 10 comprises: an insulating substrate 1; multiple semiconductor element connection pads 3 which are formed on the insulating substrate 1 and varied in height; a solder resist layer 4 formed to have multiple openings for separately exposing the semiconductor element connection pads 3 on the insulating substrate 1; and solder bumps 5 deposited on the semiconductor element connection pads 3, respectively, with uniform volume. In order to make heights of the solder bumps 5 after deposition be uniform, the opening of the solder resist layer 4 for the higher semiconductor element connection pad 3 has a larger opening size and the opening of the solder resist layer 4 for the lower semiconductor element connection pad 3 has a smaller opening size.SELECTED DRAWING: Figure 1 |
