SEMICONDUCTOR LIGHT EMITTING DEVICE

摘要

A semiconductor light emitting device includes a package body having first and second surfaces being opposed to each other, first and second external terminal blocks disposed in opposite end portions of the package body, respectively, and having portions exposed to surfaces of the package body, respectively. A wavelength converting material layer is disposed between the first and second external terminal blocks and has a first surface substantially coplanar with the first surface of the package body, and a second surface opposing the first surface of the wavelength converting material layer. A LED chip is disposed package body on at least a portion of the second surface of the wavelength converting material layer between the first and second external terminal blocks within the package body.

主权项

1. A semiconductor light emitting device, the device comprising:
a package body having first and second surfaces being opposed to each other, and a plurality of side surfaces disposed therebetween; first and second external terminal blocks disposed in opposite end portions of the package body, respectively, and each having a portion exposed to surfaces of the package body; a wavelength converting material layer disposed between the first and second external terminal blocks, and having a first surface substantially coplanar with the first surface of the package body, and a second surface opposing the first surface of the wavelength converting material layer; and a semiconductor light emitting diode (LED) chip disposed between the first and second external terminal blocks within the package body, disposed on at least a portion of the second surface of the wavelength converting material layer, and electrically connected to the first and second external terminal blocks.