| 摘要 |
The present invention addresses the problem of providing a sample-holding device that does not damage a sample such as a semiconductor substrate 10. The sample-holding device 1 of the present embodiment is a Bernoulli chuck, and is composed of a main body 2 and positioning members 3. The positioning members 3 are three-dimensional members. An effective portion M that projects below a sample-holding surface 5 is surrounded by an inward-facing surface A, an outward-facing surface B that faces the outer side (the opposite relative to the sample-holding surface 5), a downward-facing surface C that connects the inward-facing surface A and the outward-facing surface B and extends parallel to the sample-holding surface 5, and side surfaces D that connect the inward-facing surface A, the outward-facing surface B, and the downward-facing surface C. The positioning members 3 have no angular portions. |
