CONDUCTIVE PASTE, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a conductive paste which enables solder grains to be arranged efficiently on electrodes, and can improve conduction reliability between the electrodes.SOLUTION: The conductive paste comprises a thermosetting component and a plurality of solder grains. When the thermosetting component and the solder grains are subjected respectively to a differential scanning calorimetric measurement by heating at a rate of temperature increase of 10°C/min, an exothermic peak top temperature at major curing of the thermosetting component is higher than an endothermic peak top temperature at melting of the solder grains, and an absolute value of a difference between the exothermic peak top temperature at the major curing of the thermosetting component and the endothermic peak top temperature at the melting of the solder grains is 10°C or more and 70°C or less.SELECTED DRAWING: Figure 1