A heating module for use in a substrate processing chamber. The heating module having a housing with a heat source therein. The heating module can be part of a gas distribution assembly positioned above a susceptor assembly to heat the top surface of the susceptor and wafers directly. The heating module can have constant or variable power output. Processing chambers and methods of processing a wafer using the heating module are described.
申请公布号
WO2016054401(A1)
申请公布日期
2016.04.07
申请号
WO2015US53535
申请日期
2015.10.01
申请人
APPLIED MATERIALS, INC.
发明人
YUDOVSKY, JOSEPH;TRUJILLO, ROBERT T.;GRIFFIN, KEVIN;KWONG, GARRY K;BERA, KALLOL;XIA, LI-QUN;SRIRAM, MANDYAM