| 发明名称 |
Electronic Module Comprising a Plurality of Encapsulation Layers and a Method for Producing It |
| 摘要 |
An electronic module includes a first insulation layer, at least one carrier having a first main surface, a second main surface situated opposite the first main surface, and side surfaces connecting the first and second main surfaces to one another, at least one semiconductor chip arranged on the second main surface of the carrier, wherein the semiconductor chip has contact elements, and a second insulation layer, which is arranged on the carrier and the semiconductor chip. |
| 申请公布号 |
US2016099207(A1) |
申请公布日期 |
2016.04.07 |
| 申请号 |
US201514876624 |
申请日期 |
2015.10.06 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
Fuergut Edward;Gruber Martin;Hoegerl Juergen |
| 分类号 |
H01L23/498;H01L21/56;H01L21/48 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic module, comprising
a first insulation layer; at least one electrically conductive carrier having a first main surface, a second main surface situated opposite the first main surface, and side surfaces connecting the first and second main surfaces to one another; at least one semiconductor chip arranged on the second main surface of the carrier, wherein the semiconductor chip has contact elements; a second insulation layer, which is arranged on the at least one carrier and the at least one semiconductor chip. |
| 地址 |
Fillach AT |
