ADJUSTING A SUBSTRATE POLISHING CONDITION

摘要

A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.

主权项

1. A method for adjusting a polishing condition, said method comprising:
providing a polishing pad to polish a substrate, a top ring to hold the substrate, and a temperature adjusting mechanism to control a temperature of the polishing pad; measuring an elastic modulus of the polishing pad; and adjusting the temperature of the polishing pad based on a relationship between a measured value of the elastic modulus of the polishing pad and a size of surface of the substrate.