MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEADS FOR STACKED DIE PACKAGES, AND ASSOCIATED SYSTEMS AND METHODS

摘要

Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.

主权项

1. A method of manufacturing a microelectronic device, the method comprising:
stacking a first die package having a first dielectric casing and a first bottom side on a top side of a second die package having a second dielectric casing, wherein the first dielectric casing defines at least a portion of the first bottom side, and wherein the second dielectric casing defines at least a portion of the top side; aligning first metal leads coupled to the first bottom side of the first die package with second metal leads coupled to the second bottom side of the second die package; attaching the second die package to the first die package with an adhesive layer; and forming individual external inter-package connectors attached to a first portion of individual first leads and to a second portion of individual second leads that are spaced apart from a lateral side of the second casing and project towards the first package.