CURABLE RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a cured product having excellent heat resistance, transparency and flexibility and having especially excellent barrier properties for corrosive gas.SOLUTION: There is provided a curable resin composition comprising a polyorganosiloxane (A), an isocyanurate compound (B) and a silane coupling agent (C) in which the polyorganosiloxane (A) is a polyorganosiloxyl alkylene having a structure represented by the formula (I). (Rto Reach independently represents a monovalent hydrocarbon group or a monovalent heterocyclic group, provided that a part or all of Rto Ris an aryl group; Rrepresents a divalent hydrocarbon group; and s1 and s2 each independently represents an integer of 1 or more.)SELECTED DRAWING: None